title
  • image of System On Chip (SoC)>XCVM1502-2MLIVFVC1760
  • image of System On Chip (SoC)>XCVM1502-2MLIVFVC1760
  • Part number XCVM1502-2MLIVFVC1760
    Product classification System On Chip (SoC)
    description IC VERSALPRIME ACAP FPGA 1760BGA
    encapsulation Tray
    quantity 200
    price $12,438.7500
    RoHS status YES
    specifications
    PDF(1)
    TYPEDESCRIPTION
    MfrXilinx (AMD)
    SeriesVersal™ Prime
    PackageTray
    Product StatusACTIVE
    Package / Case1760-BFBGA, FCBGA
    Speed600MHz, 1.4GHz
    RAM Size256KB
    Operating Temperature-40°C ~ 110°C (TJ)
    Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
    Primary AttributesVersal™ Prime FPGA, 1M Logic Cells
    ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    PeripheralsDDR, DMA, PCIe
    Supplier Device Package1760-FCBGA (40x40)
    ArchitectureMPU, FPGA
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